Hybrid Bonding Equipment
The fully automatic wafer hybrid bonding system is a highly automated and highly integrated bonding device that meets the requirements of hybrid bonding. It integrates multiple functional modules of the bonding process and truly realizes the direct bonding process at room temperature.- Product introduction
- Product features
- Technical parameters
- Reference picture
- The fully automatic wafer hybrid bonding system is a highly automated and highly integrated bonding device that meets the requirements of hybrid bonding. It integrates multiple functional modules of the bonding process and truly realizes the direct bonding process at room temperature.
- Provide fully automatic EFEM
- Provide debonding function
- Provide pre-alignment function
- Provide ID reading function
- Provide plasma activation function
- Provide cleaning function
- Provide high-precision alignment function
- Provide room temperature pre-bonding function
- Provide alignment check function
- Provide high-precision wafer transfer system
- ID reader
- Pre-alignment
- Debonding unit
- Alignment check unit
- Align the pre-bonding unit
- Plasma activation unit
- Cleaning unit
- Transmission robot
- EFEM
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