SiC Laser Annealing Equipment
- Product introduction
- Product features
- Technical parameters
- Reference picture
- Professional process equipment for annealing processing of semiconductor material SiC, with outstanding modular design, flexible and reliable methods of integration, can not be only used for experimental research and development, but also for manufacturing of industrial grade products. The equipment can achieve precise positioning and efficiently reliable transformission for 4/6 inch ultra-thin wafers and large warpage wafers, also offers various functions such as process chamber controlled oxygen content ＜10ppm, visual positioning, real-time monitoring of process parameters, etc.
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