UPLD-150/200/300
UPLD系列设备，专为硅基功率器件背面退火量产工艺开发，采用优秀的模块化设计及升级版方案，可实现超薄晶圆和大翘曲晶圆的精确定位及快速可靠传输，采用独特的工艺参数匹配技术，兼顾实现浅层、深层的高效激活，满足多工艺用途、大范围应用的材料退火实际需求。- 产品介绍
- 产品特性
- 技术参数
- 图片参考
- UPLD系列设备，专为硅基功率器件背面退火量产工艺开发，采用优秀的模块化设计及升级版方案，可实现超薄晶圆和大翘曲晶圆的精确定位及快速可靠传输，采用独特的工艺参数匹配技术，兼顾实现浅层、深层的高效激活，满足多工艺用途、大范围应用的材料退火实际需求。
UPLD System, is an advanced industrial solution for Backside annealing process of silicon power devices. The modular system is an attractive enabler for both process development and final industrial product. The integrated wafer handling technology provides precise, reliable and efficient wafer transportation for ultra-thin wafers and warped wafers. The excellent activation for both shallower and deeper applications can be achieved by our know-how technology, and the annealing performance and the throughput are well balanced.
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